Advanced Thermal Solutions
cTech offer advanced thermal solutions. When standard cooling solutions no longer work, a variety of technologies such as heat pipes, vapour chambers, annealed pyrolytic graphite, liquid cold plate and more can be used to get the required thermal solution.
Thermal design
![Thermal design](https://ctech.co.uk/wp-content/uploads/2013/04/Thermal-design-1.jpg)
We will take an initial concept and using proprietary spread sheets, calculations, CFD and a wealth of knowledge and expertise, design a thermal solution for cost, manufacturability, weight, aesthetics and performance.
Heat pipes
![Heat pipes](https://ctech.co.uk/wp-content/uploads/2013/04/Heat-pipes-1.jpg)
Heat pipes are a great solution to many thermal problems offering design flexibility. They are typically used to move heat from where it can’t be managed to where it can, from a hot component to a fin stack or heat sink, or embedded in the base of a heat sink to reduce thermal spreading resistances and making the heat sink work efficiently.
Liquid cold plate
![Liquid cold plates](https://ctech.co.uk/wp-content/uploads/2013/04/Liquid-cold-plates.jpg)
For cooling high-power semiconductors and other demanding applications where air cooling is inadequate. Various designs can be used for budget or performance.
Heat spreaders
![Heat spreaders](https://ctech.co.uk/wp-content/uploads/2013/04/Heat-spreaders.jpg)
Heat spreading is often necessary to improve the efficiency of a heat sink and therefore further reduce component temperature. This can be done using vapour chamber technology or encapsulated annealed pyrolytic graphite.